A global designer and Manufacturer of EMS solution provider
Our vertically integrated Electronic Manufacturing Services (EMS) capabilities provide our customers with significant benefits when it comes to product manufacturing, assembly and supply.
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What we do?
Rapid PrototypingContract designNew Product IntroductionPCB Assembly & TestCable & Harness assemblyManufacturingBox-Build AssemblyTest Development & ImplementationPlastic Injection MoldingPlastic Thermoforming
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Eelectronic Manufacturing Service
Operating in several locations across China and Vietnam, PYS is a full-service, high-mix, low- to mid-volume EMS provider with a proven track record of delivering high-quality, custom-designed electronic manufacturing services and supply chain solutions to a diverse group of OEMs.
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New Product Introduction (NPI)
Complete End-to-End NPI Services
DFM (design for manufacturability)
DFT (design for testability)
BOM review
Risk analysis
Lead-time analysis
Availability analysis
Test development and implementation
Test strategy/plan
Flying probe (FP)
In-circuit test (ICT)
Functional test
Boundary scan
Customer supplied equipment
PPAP (production part approval process)
PFMEA (process failure modes and effects analysis)
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Printed Circuit Board Assembly (PCBA)
PCBA at the heart of our electronic contract manufacturing company
Our cutting-edge equipment and years of expertise allow us to be one of the most active printed circuit board assembly manufacturers, worldwide. Contract manufacturer delivering engineering and manufacturing services to all industries, we''ve started our history with printed circuit board assembly before offering fully integrated solutions, from design to mass production, to our customers.
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Cable & Wire Harness Assembly
Our products associated with these services include:
Harsh-environment cable assemblies
Harnesses
Control panels/boxes
Mechanical subassemblies
Panel wiring and assembly
PYS provide engineering, testing, and manufacturing the products.
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Advanced Engineering Services
Design for Excellence (DFX)
- Reduced lead time and material costs (DFSC)
- Improved PCB yield and cost (DFF)
- Improved assembly yield and reduced labor content (DFA)
- Improved coverage and final yield, reduced RMA, and field failures (DFT)
- Reduced engineering development and resources, improved time to market (development)
- Improved production stability and predictability (DFM)
- Continuous improvement (post-DFM, ROI).